Bondmaster HSC-9000 Bonding Repair And Production System For LCD

Description

Bondmaster HSC-9000 Bonding Repair And Production System For LCD
The Bondmaster HSC-9000 (110v US)is a proven bonding repair and production system for Liquid Crystal Displays, which are bonded by Heat Seal Connector contacts (HSC) or Reflow Solder contacts, as used in Pagers, Portable Radios, PCMCIA, and PCS devices. Features: HSC,Mylar,PCMCIA,Flexible Circuit connections Microprocessor controlled Self-contained, no PC or factory air required Linear pressure control Precise temperature control and profiling Repeatable process control Continuous or pulse operation Pre-stored profile groups User programmable Floating and self-aligning Bond Head Thermal bonding reservoir "Super Flat" bonding surface Thermal stability throughout bonding cycle No silicone barrier requiredProcess Control Programmable Features: Ramp rate degree/sec Ramp rate time vs. temp Programmable set point Celsius or Fahrenheit Ramp time 15 (continuous) sec to 3 minutesBondMaster Fixturing The BondMaster has been engineered to enable rapid interchange of differing product assemblies, not only for Pager products listed but also for production assembly of LCD and Flexible Circuits.
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